284 Technologies | Semiconductor Equipment

Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.

To-date, Advanced Vacuum have four broad preconfigured toolsets available;

- Reactive Ion Etch (RIE)

- Plasma-Enhanced Chemical Vapor Deposition (PECVD)

- Sputter Deposition (4 variations)

- Barrel Etch (2 variations)

This listing is for the PlasmaPOD™ Reactive Ion Etch (RIE), which is available as a 300W RF Generator with auto-matching. Addition features include:

- Aluminum chamber

- 125mm electrode; water-cooled

- Internal PLC control system

- Touch-screen interface

- Capacitance manometer gauge for pressure measurement

- Automatic closed loop pressure control

- Close-coupled turbo

- All control within the frame to minimize the footprint

- Built-in process recipe control and data logging

Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.

To-date, Advanced Vacuum have four broad preconfigured toolsets available;

- Reactive Ion Etch (RIE)

- Plasma-Enhanced Chemical Vapor Deposition (PECVD)

- Sputter Deposition (4 variations)

- Barrel Etch (2 variations)

This listing is for the PlasmaPOD™ Plasma Deposition (PECVD), which is available as a 300W RF Generator with auto-matching. Addition features include:

- Aluminium chamber with water cooling

- 240mm Heated electrode manufactured in stainless steel

- Internal PLC control system

- Touch-screen interface

- Capacitance manometer for pressure measurement

- Automatic closed-loop pressure control

- All control within the frame to minimize the footprint

- Built in process recipe control and data logging

Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.

To-date, Advanced Vacuum have four broad preconfigured toolsets available;

- Reactive Ion Etch (RIE)

- Plasma-Enhanced Chemical Vapor Deposition (PECVD)

- Sputter Deposition (4 variations)

- Barrel Etch (2 variations)

This listing is for the PlasmaPOD™ Sputter Deposition, which is available as a 300W RF Generator with auto-matching. Addition features include:

- Stainless Steel chamber with internal shields

- 160mm electrode with rotation (optional water cooling)

- 2 gas lines (inc. MFCs)

- 3 configurations of Magnetrons plus fittings are available

- Internal PLC control system

- Touch-screen interface

- Automatic closed-loop pressure control

- Close-coupled Turbo (requires backing pump)

- All control within the frame to minimize the footprint

- Built-in process recipe control and data logging

Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.

To-date, Advanced Vacuum have four broad preconfigured toolsets available;

- Reactive Ion Etch (RIE)

- Plasma-Enhanced Chemical Vapor Deposition (PECVD)

- Sputter Deposition (4 variations)

- Barrel Etch (2 variations)

This listing is for the PlasmaPOD™ Barrel Etch, which is available with either a 300W or 600W RF Generator and auto-matching. Addition features include:

- Stainless Steel chamber with Aluminum Faraday Cage assembly

- 2 gas lines (inc MFCs)

- Internal PLC control system

- Touch-screen interface

- Capacitance manometer for pressure measurement

- Automatic closed-loop pressure control

- All controls are within the frame to minimize the footprint

- Built-in process recipe control and data logging

Get maximum flexibility with the only 200mm etch system with the capability to support ICP, RIE, ALE and DRIE technologies in the SAME reactor. The Corial 210IL is designed for R&D and low volume production, and offers a wide range of applications for the specialty semiconductor market.

This etcher is based on Corial's latest generation of inductively coupled plasma reactor. The system features high density plasma, helical antenna, 2 MHz ICP RF generator and quartz liner, enabling high etch rates and excellent uniformities. Featuring a vacuum load lock, it also ensures stable process conditions and short pumping cycles, and offers the capability to run fluorinated and chlorinated chemistries in the same process recipe.

In addition, the Corial 210IL ICP-RIE system can process a wide range of materials including silicon, oxides, nitrides, polymers, metals, III-V & II-VI compound semiconductors, and hard materials. When equipped with a 2 kW ICP source, the 210IL enables deep reactive ion etching of hard materials as Al2O3, SiC, LiTaO3, sapphire and glass.

With the CORTEX Pulse software, pulsed or time-multiplexed processes can also be applied for Atomic Layer Etching (ALE) and deep silicon etch (DRIE) on the conventional Corial 210IL ICP-RIE system.

Corial's Kayen HDRF is a unique plasma-based system for photoresist removal and wafer surface treatment. It is the most efficient and cost-effective system available for microelectronics manufacturing today.

Unlike conventional photoresist strip systems, Corial utilizes High-Density Radical Flux (HDRF) technology which produces high concentrations of reactive radicals, without charged particles or unwanted photons. This chemical (non-physical), non-damaging plasma is ideal for conventional and low-temperature applications. Kayen HDRF™ is likewise designed for batch processing and can be easily reconfigured for single wafers. Key applications and features include:

- Low-temperature (50˚C to 150˚C) photoresist removal

- High-rate (150˚C to 250˚C) photoresist removal

- Surface organic cleaning

- Sacrificial polymer release for MEMS devices

- HDRF™ ICP plasma source delivers high-density, damage-free plasma

- 13.56MHz RF package with automatic impedance-matching network

- Heated, barrel-style process chamber

- High-conductance vacuum train with VAT™ throttle valve

- Up to five gas channels (two included) with digital MFCs

- Manual loading and easily configurable for single-substrate and multi-substrate processing

The Takachi provides etching capabilities over a variety of materials and substrates. The small footprint, low cost, ease of use and superior performance make the Takachi Series ideal for a wide range of uniform, high quality ICP etch applications serving R&D, FA, prototyping, pilot line and low volume production. The Takachi Series is ideal for numerous technologies such as Failure/Yield Analysis, Photonics, Solid State Lighting, MEMs, and Wireless ICP etch processing.

The Takachi Series provides technology for etch using a high density ICP source with a RF biased lower electrode, whilst also utilizing a load lock with manual loading that incorporates Plasma-Therm’s highly regarded Shuttlelock® system in a compact, robust and easily maintained form factor. In addition, the Takachi boasts a number of productivity enhancements:

- Process Library: Uses well-established reactor technology that provides reliable performance and is supported with guidance from a continuously evolving process library.

- Endpoint: Both laser and optical emission spectroscopy endpoint technologies are available to augment processing capability.

- Data Logging: Simplified data collection for sharing of process monitoring and recipe information.

High quality films deposition at low temperature, adaptable to a wide range of substrate sizes.

The Corial 210D ICP-CVD high density system is ideal for R&D centres, and offers a wide range of applications for the specialty semiconductor markets. It is based on the company's latest generation of 2 MHz helical ICP reactor. It is equipped with separate gas injection for SiH4 and dopants, to deposit high quality SiO2, Si3N4, SiOCH, SiOF, SiC and aSi-H films at low temperature (<150°C). High-temperature reactor walls supports short plasma cleaning times and low added particles, whilst its vacuum load lock can help to deliver stable process conditions and short pump-down times. In addition, Corial's COSMA Pulse software enables pulsed or time-multiplexed processes to support applications ranging from deposition of super lattices for stress relief, to Atomic Layer Deposition films - these are all available on a conventional 210D.

Industry-leading uniformity for etching silicon-based compounds and polymers.

The Corial 200I ICP-RIE system is designed for R&D centers and IC failure analysis labs. This equipment uses fluorine- and oxygen-based chemistries to provide leading edge etch rates and uniformities for full wafers of up to 200 mm, as well as dies or packaged dies. Featuring a short pump-down cycle (<3 minutes), rapid reactor clean time (<20 minutes), and shuttle loading direct on the carrier, the Corial 200I guarantees high system uptime.

Typical materials that can be processed with the Corial 200I ICP-RIE system include:

- Silicon and silicon-based compounds (SiO2, Si3N4)

- Polymers: PMMA, Polyimide, BCB, Photoresist

- Metals: Ti, TiN, TiW, W, Ta, TaN, Ge, Nb, Nbn, Mo

The Corial 200I also offers differentiated technology and application-focused capabilities for the IC failure analysis and the R&D markets:

- Delayering of polymers and silicon-based compounds for sample preparation prior to IC failure analysis

- Capability to etch the wide range of materials used in R&D centers

Anisotropic RIE etching supported by a wide range of processes.

 The Corial 210RL offers a flexible solution for reactive ion etching of wafer pieces, of up to full 200mm wafers. Designed with a vacuum load-lock, the Corial 210RL provides RIE capabilities over a variety of materials including silicon, silicon compounds, polymers, III-V and II-VI compound semiconductors, and metals.

Likewise, Corial's extensive process library for the 210RL etcher supports a wide range of materials. It uses fluorinated reactive gases for Si, SiO2, Si3N4, Ge, W, Ta, TaN, Ti, TiN, TiW, Nb, NbN, Mo and polymer etching. To structure materials such as GaN, AlGaN, GaAs, InP and metals as Al, Cr, Ti, this RIE etcher uses CH4/H2 and chlorinated reactive gases.

Accordingly, with a small footprint and modular design approach supporting tiered upgrades, this etch tool is ideal for R&D centres.