Plasma-Therm - PlasmaPOD™ - Reactive Ion Etch (RIE)
Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.
To-date, Advanced Vacuum have four broad preconfigured toolsets available;
- Reactive Ion Etch (RIE)
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Sputter Deposition (4 variations)
- Barrel Etch (2 variations)
This listing is for the PlasmaPOD™ Reactive Ion Etch (RIE), which is available as a 300W RF Generator with auto-matching. Addition features include:
- Aluminum chamber
- 125mm electrode; water-cooled
- Internal PLC control system
- Touch-screen interface
- Capacitance manometer gauge for pressure measurement
- Automatic closed loop pressure control
- Close-coupled turbo
- All control within the frame to minimize the footprint
- Built-in process recipe control and data logging
Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.
To-date, Advanced Vacuum have four broad preconfigured toolsets available;
- Reactive Ion Etch (RIE)
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Sputter Deposition (4 variations)
- Barrel Etch (2 variations)
This listing is for the PlasmaPOD™ Reactive Ion Etch (RIE), which is available as a 300W RF Generator with auto-matching. Addition features include:
- Aluminum chamber
- 125mm electrode; water-cooled
- Internal PLC control system
- Touch-screen interface
- Capacitance manometer gauge for pressure measurement
- Automatic closed loop pressure control
- Close-coupled turbo
- All control within the frame to minimize the footprint
- Built-in process recipe control and data logging
Earlier this year Plasma-Therm (Advanced Vacuum's parent company) acquired JLS Design Ltd in the United Kingdom, and with that came the PlasmaPOD™. These tools are small, compact table-top systems specifically designed for space-constrained University labs that are running Material Science courses, R&D departments of small to midscale device manufacturers who want to keep the cost of development under control, and small Failure Analysis departments where space and price are purchase constraints.
To-date, Advanced Vacuum have four broad preconfigured toolsets available;
- Reactive Ion Etch (RIE)
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Sputter Deposition (4 variations)
- Barrel Etch (2 variations)
This listing is for the PlasmaPOD™ Reactive Ion Etch (RIE), which is available as a 300W RF Generator with auto-matching. Addition features include:
- Aluminum chamber
- 125mm electrode; water-cooled
- Internal PLC control system
- Touch-screen interface
- Capacitance manometer gauge for pressure measurement
- Automatic closed loop pressure control
- Close-coupled turbo
- All control within the frame to minimize the footprint
- Built-in process recipe control and data logging
This equipment is advertised on behalf of Plasma-Therm LLC