Plasma-Therm - Eclipse™ PVD System (Mark II, IV and Support)

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Currently, Plasma-Therm is the authorised manufacturer for refurbished MRC Eclipse Mark II and IV PVD systems, along with factory-approved upgrades and spare parts support.

The Eclipse Mark IV physical vapour deposition (PVD) system is an upgrade from the Mark II, offering a larger process portfolio and occupying a smaller footprint. The Mark IV is used for depositing metal for interconnects, via fill, silicides, packaging (C4, die attach), and other processes. The wafer transport is suitable for gallium arsenide, other compound semiconductor wafers, and thinned silicon wafers. Sputtering occurs in vacuum-isolated chambers, limiting contamination. The system features the upgraded Epoch controller with enhanced throughput and factory automation support.

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Currently, Plasma-Therm is the authorised manufacturer for refurbished MRC Eclipse Mark II and IV PVD systems, along with factory-approved upgrades and spare parts support.

The Eclipse Mark IV physical vapour deposition (PVD) system is an upgrade from the Mark II, offering a larger process portfolio and occupying a smaller footprint. The Mark IV is used for depositing metal for interconnects, via fill, silicides, packaging (C4, die attach), and other processes. The wafer transport is suitable for gallium arsenide, other compound semiconductor wafers, and thinned silicon wafers. Sputtering occurs in vacuum-isolated chambers, limiting contamination. The system features the upgraded Epoch controller with enhanced throughput and factory automation support.

Currently, Plasma-Therm is the authorised manufacturer for refurbished MRC Eclipse Mark II and IV PVD systems, along with factory-approved upgrades and spare parts support.

The Eclipse Mark IV physical vapour deposition (PVD) system is an upgrade from the Mark II, offering a larger process portfolio and occupying a smaller footprint. The Mark IV is used for depositing metal for interconnects, via fill, silicides, packaging (C4, die attach), and other processes. The wafer transport is suitable for gallium arsenide, other compound semiconductor wafers, and thinned silicon wafers. Sputtering occurs in vacuum-isolated chambers, limiting contamination. The system features the upgraded Epoch controller with enhanced throughput and factory automation support.


This equipment is advertised on behalf of Plasma-Therm LLC