ETCH/Plasma Etching | High Density Radical Flux (HDRF™)

Proven and safe material removal for demanding applications.

Plasma-Therm's HDRF low temperature technology is proven for demanding applications. Remove photoresist and polymer residue without damaging your sensitive devices and complex structures – for optimal quality of Bosch-process devices.

Proprietary Source

HDRF technology incorporates a proprietary, distributed inductively coupled plasma (ICP) source.

Source Design

The unique source design produces 50 to 100 times more radicals than other technologies and delivers damage-free process results.

Before and After

The HDRF application portfolio includes scallop smoothing after DRIE, and surface activation before wafer bonding

Other Processes

Plasma-Therm’s high temperature stripping can also support descum and polyimide processes, as well as BCB, SU8 and PBO ashing.