284 Technologies | Plasma-Enhanced Deposition Processes
Deposition processes are used throughout the semiconductor manufacturing process to create integrated circuits (ICs). Nearly every step in the device fabrication process uses a form of thin-film deposition. Thin films are used in passive roles as hard masks, antireflection coatings, passivation layers, and encapsulation, as well as in active device roles such as capacitors, inductors, contacts, and interconnects. Thin-film materials include dielectrics, metals, and polymers. Many of them involve a plasma deposition process to deliver the desired film properties within a defined thermal budget.
Plasma-Therm® have fine-tuned an assortment of plasma-enhanced deposition processes to help you achieve precisely the film features you need for optimal device performance. From dielectric films to metallization, dopants to anti-reflectant coatings and encapsulation, plasma-based deposition processes deliver on performance, precision, flexibility, and process control. Please select from the links below to find out more about each of these processes:
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
High-Density Plasma Chemical Vapor Deposition (HDPCVD)
Fast Atomic Sequential Technology (F.A.S.T.®)