NADAtech Sorter+ Options - Wafer Thickness Measurement

$0.00

- Average thickness/ttv/bow/warp

- 150mm/200mm/300mm

- Single center point or radial profiling

- Confocal laser or white light interferometer depending on application

- White light interferometer with 0.3 um repeatability

- On robot approach for high throughput

- Function can be added to any typical sorting recipe

- Typical recipes bin wafer based on thickness

Sorter+ Options (About)

Add Dual and Triple Functionality to Standard Systems

In addition to standalone wafer automation equipment, it is also possible to extend the functionality of your systems with NADAtech’s various Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications, without needing to add extra equipment to your current production floor. Accordingly, each of these products have been listed separately and can be identified by the preceding heading 'Sorter+ Options'.

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- Average thickness/ttv/bow/warp

- 150mm/200mm/300mm

- Single center point or radial profiling

- Confocal laser or white light interferometer depending on application

- White light interferometer with 0.3 um repeatability

- On robot approach for high throughput

- Function can be added to any typical sorting recipe

- Typical recipes bin wafer based on thickness

Sorter+ Options (About)

Add Dual and Triple Functionality to Standard Systems

In addition to standalone wafer automation equipment, it is also possible to extend the functionality of your systems with NADAtech’s various Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications, without needing to add extra equipment to your current production floor. Accordingly, each of these products have been listed separately and can be identified by the preceding heading 'Sorter+ Options'.

- Average thickness/ttv/bow/warp

- 150mm/200mm/300mm

- Single center point or radial profiling

- Confocal laser or white light interferometer depending on application

- White light interferometer with 0.3 um repeatability

- On robot approach for high throughput

- Function can be added to any typical sorting recipe

- Typical recipes bin wafer based on thickness

Sorter+ Options (About)

Add Dual and Triple Functionality to Standard Systems

In addition to standalone wafer automation equipment, it is also possible to extend the functionality of your systems with NADAtech’s various Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications, without needing to add extra equipment to your current production floor. Accordingly, each of these products have been listed separately and can be identified by the preceding heading 'Sorter+ Options'.


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This equipment is advertised on behalf of NADA Technologies, LLC (NADAtech)