NADAtech Sorter+ Options- Wafer Surface Inspection (+Dimple)
- Surface defects are detected and measured using fully integrated Hologenix optics
- Uses defocused optics for finding surface defects (dimples or mounds)
- Typical for wafer polishing defects
- Perfect for finding Post CMP over and under polished areas
- Also used for Post wafer bond MEMS defect inspection
- 150mm / 200mm / 300mm versions
- Whole wafer image processing or magnified version are available
- Optional stocker and agv integrated e84 delivery
Sorter+ Options (About)
Add Dual and Triple Functionality to Standard Systems
In addition to standalone wafer automation equipment, it is also possible to extend the functionality of your systems with NADAtech’s various Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications, without needing to add extra equipment to your current production floor. Accordingly, each of these products have been listed separately and can be identified by the preceding heading 'Sorter+ Options'.
- Surface defects are detected and measured using fully integrated Hologenix optics
- Uses defocused optics for finding surface defects (dimples or mounds)
- Typical for wafer polishing defects
- Perfect for finding Post CMP over and under polished areas
- Also used for Post wafer bond MEMS defect inspection
- 150mm / 200mm / 300mm versions
- Whole wafer image processing or magnified version are available
- Optional stocker and agv integrated e84 delivery
Sorter+ Options (About)
Add Dual and Triple Functionality to Standard Systems
In addition to standalone wafer automation equipment, it is also possible to extend the functionality of your systems with NADAtech’s various Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications, without needing to add extra equipment to your current production floor. Accordingly, each of these products have been listed separately and can be identified by the preceding heading 'Sorter+ Options'.
- Surface defects are detected and measured using fully integrated Hologenix optics
- Uses defocused optics for finding surface defects (dimples or mounds)
- Typical for wafer polishing defects
- Perfect for finding Post CMP over and under polished areas
- Also used for Post wafer bond MEMS defect inspection
- 150mm / 200mm / 300mm versions
- Whole wafer image processing or magnified version are available
- Optional stocker and agv integrated e84 delivery
Sorter+ Options (About)
Add Dual and Triple Functionality to Standard Systems
In addition to standalone wafer automation equipment, it is also possible to extend the functionality of your systems with NADAtech’s various Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications, without needing to add extra equipment to your current production floor. Accordingly, each of these products have been listed separately and can be identified by the preceding heading 'Sorter+ Options'.
This equipment is advertised on behalf of NADA Technologies, LLC (NADAtech)