NADAtech Sorter+ Options - Wafer Edge (+ChipChecker)
- The Wafer Edge Inspection is one of NADAtech’s first Sorter+ Options
- Top and bottom bevel inspection option
- Function can be added to any typical sort recipe
- Scans wafer bevel for cracks and chips after Align / OCR function
- Standard ASCII and SECS / GEM reporting with defect size and location
- Optional image capture and industry standard XY Report Formating
- Captures defects down to 0.5mm, with latest generation seeing defects down to 60um
- Version 1.0 flags failed wafers and shows number of chips >0.3mm defect bare wafer / >0.5mm defect processed
- Version 2.0 easily detects bonding edge problems and captures multi-tiff images of each chip for K L A R F, recording chip location and size
Sorter+ Options (About)
Add Dual and Triple Functionality to Standard Systems
In addition to standalone wafer automation equipment, it is also possible to extend the functionality of your systems with NADAtech’s various Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications, without needing to add extra equipment to your current production floor. Accordingly, each of these products have been listed separately and can be identified by the preceding heading 'Sorter+ Options'.
- The Wafer Edge Inspection is one of NADAtech’s first Sorter+ Options
- Top and bottom bevel inspection option
- Function can be added to any typical sort recipe
- Scans wafer bevel for cracks and chips after Align / OCR function
- Standard ASCII and SECS / GEM reporting with defect size and location
- Optional image capture and industry standard XY Report Formating
- Captures defects down to 0.5mm, with latest generation seeing defects down to 60um
- Version 1.0 flags failed wafers and shows number of chips >0.3mm defect bare wafer / >0.5mm defect processed
- Version 2.0 easily detects bonding edge problems and captures multi-tiff images of each chip for K L A R F, recording chip location and size
Sorter+ Options (About)
Add Dual and Triple Functionality to Standard Systems
In addition to standalone wafer automation equipment, it is also possible to extend the functionality of your systems with NADAtech’s various Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications, without needing to add extra equipment to your current production floor. Accordingly, each of these products have been listed separately and can be identified by the preceding heading 'Sorter+ Options'.
- The Wafer Edge Inspection is one of NADAtech’s first Sorter+ Options
- Top and bottom bevel inspection option
- Function can be added to any typical sort recipe
- Scans wafer bevel for cracks and chips after Align / OCR function
- Standard ASCII and SECS / GEM reporting with defect size and location
- Optional image capture and industry standard XY Report Formating
- Captures defects down to 0.5mm, with latest generation seeing defects down to 60um
- Version 1.0 flags failed wafers and shows number of chips >0.3mm defect bare wafer / >0.5mm defect processed
- Version 2.0 easily detects bonding edge problems and captures multi-tiff images of each chip for K L A R F, recording chip location and size
Sorter+ Options (About)
Add Dual and Triple Functionality to Standard Systems
In addition to standalone wafer automation equipment, it is also possible to extend the functionality of your systems with NADAtech’s various Sorter+ Inspection and Metrology Options. Find and measure defects on wafer surfaces and edges using a variety of specially designed applications, without needing to add extra equipment to your current production floor. Accordingly, each of these products have been listed separately and can be identified by the preceding heading 'Sorter+ Options'.
This equipment is advertised on behalf of NADA Technologies, LLC (NADAtech)