NADAtech Automated Optical Inspection (AOI) Wafer Systems
NADAtech's Automated Optical Inspection (AOI) Wafer Systems identify wafers with defects and keep them from moving forward in your production line. The AOI module was created to single out wafers with common visible macro defects as well as polishing and postbond wafer surface defects such as dimple and mound defects that are NOT visible to the naked eye, without the use of golden images, while adding minimal time to the inspection process. The FLEX system allows you to mix and match inspection modules specific for your application to extend the functionality of your system. Key features include:
- INLINE inspection for wafer sorters
- 150mm / 200mm / 300mm dual Brightfield / Darkfield wafer inspection
Brightfield can resolve visible macro defects down to 200um
Darkfield excels at anything residing above the wafer surface such as particles and scratches
- 150mm / 200mm makyoh optics for surface defect issues
- 1x inspection for both macro and dust defects
- Provides visual inspection for patterned and non patterned wafers on front, back or both sides of wafers
- Completely integrated operation with standard ASCII and SECS / GEM reporting shows defect size and location
- Broad spectrum OMNI color LED lighting + grazing dark field LED
- Dome reflector used for omni-directional illumination
- 15mpixel color CMOS imaging camera and coaxial light port
- Excellent for 3D type defects such as EPI “volcanoes”
- Image stack post processing shows “repeaters” and defect clustering
NADAtech's Automated Optical Inspection (AOI) Wafer Systems identify wafers with defects and keep them from moving forward in your production line. The AOI module was created to single out wafers with common visible macro defects as well as polishing and postbond wafer surface defects such as dimple and mound defects that are NOT visible to the naked eye, without the use of golden images, while adding minimal time to the inspection process. The FLEX system allows you to mix and match inspection modules specific for your application to extend the functionality of your system. Key features include:
- INLINE inspection for wafer sorters
- 150mm / 200mm / 300mm dual Brightfield / Darkfield wafer inspection
Brightfield can resolve visible macro defects down to 200um
Darkfield excels at anything residing above the wafer surface such as particles and scratches
- 150mm / 200mm makyoh optics for surface defect issues
- 1x inspection for both macro and dust defects
- Provides visual inspection for patterned and non patterned wafers on front, back or both sides of wafers
- Completely integrated operation with standard ASCII and SECS / GEM reporting shows defect size and location
- Broad spectrum OMNI color LED lighting + grazing dark field LED
- Dome reflector used for omni-directional illumination
- 15mpixel color CMOS imaging camera and coaxial light port
- Excellent for 3D type defects such as EPI “volcanoes”
- Image stack post processing shows “repeaters” and defect clustering
NADAtech's Automated Optical Inspection (AOI) Wafer Systems identify wafers with defects and keep them from moving forward in your production line. The AOI module was created to single out wafers with common visible macro defects as well as polishing and postbond wafer surface defects such as dimple and mound defects that are NOT visible to the naked eye, without the use of golden images, while adding minimal time to the inspection process. The FLEX system allows you to mix and match inspection modules specific for your application to extend the functionality of your system. Key features include:
- INLINE inspection for wafer sorters
- 150mm / 200mm / 300mm dual Brightfield / Darkfield wafer inspection
Brightfield can resolve visible macro defects down to 200um
Darkfield excels at anything residing above the wafer surface such as particles and scratches
- 150mm / 200mm makyoh optics for surface defect issues
- 1x inspection for both macro and dust defects
- Provides visual inspection for patterned and non patterned wafers on front, back or both sides of wafers
- Completely integrated operation with standard ASCII and SECS / GEM reporting shows defect size and location
- Broad spectrum OMNI color LED lighting + grazing dark field LED
- Dome reflector used for omni-directional illumination
- 15mpixel color CMOS imaging camera and coaxial light port
- Excellent for 3D type defects such as EPI “volcanoes”
- Image stack post processing shows “repeaters” and defect clustering
This equipment is advertised on behalf of NADA Technologies, LLC (NADAtech)